Senator Dianne Feinstein | Official U.S. House headshot
Senator Dianne Feinstein | Official U.S. House headshot
Washington—Senators Dianne Feinstein and Alex Padilla (both D-Calif.) on June 29 applauded a new partnership between the U.S. National Science Foundation (NSF) and the National Science and Technology Council of Taiwan (NSTC) that will invest $6 million in six joint projects, including four in California, for research on advanced semiconductor chip design and fabrication.
The new awards will support collaborations between U.S. and Taiwan-based researchers on the design and fabrication of innovative semiconductor chips using the advanced processes available in Taiwan's semiconductor foundries. NSF has provided $3.3 million to the U.S. researchers involved.
“California has always been a leader in scientific and technological innovation,” Senator Feinstein said. “This joint venture between the United States and Taiwan will invest in four projects at our universities, ensuring that California’s researchers and universities remain at the forefront of the development of the next generation of semiconductor chips.”
“I am proud to see four of California’s universities receive award funding to support research and development for the next generation of semiconductor chips,” Senator Padilla said. “These investments will help lower costs, increase our STEM workforce, and ensure that California continues to lead the nation’s scientific innovation and technology sectors.”
The four California projects are:
- 240-GHz Energy-efficient CMOS MIMO Radar, University of California, Berkeley.
- On-chip CMOS-MEMS Infrared Spectroscopy Systems, University of California Davis.
- Runtime Reconfigurable Array Technology for AI/ML, University of California, Los Angeles.
- Ultrafast, low-power AI chip with a new class of MRAM for learning and inference at edge, Stanford University.
Advanced chip designs promise to lower energy consumption of microelectronic devices and systems, reduce the environmental impacts of manufacturing and increase performance measures such as speed, capacity and security. Applications include artificial intelligence, communications, computing and sensing.
The projects are supported through the NSF Advanced Chip Engineering Design and Fabrication program in partnership with NSTC's Department of Engineering and Technologies.
Original source can be found here.
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